지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
이용수
초록· 키워드
오류제보하기
Recently, electronic equipments become smaller, more functional, and more complex than before. As these trends, MLC(multi-layer ceramic) circuit has been emerged to a promising technology in semiconductor inspection industry. Especially, multi-layer ceramic which is consisted of many fine-pitch multi-hole is used to produce a semiconductor inspection unit. The hole is processed by UV laser. But, working conditions are changed all the time. Therefore real time measurement of fine-pitch multi-hole is very important method for ensuring performance. In this paper we found the best method for illuminating and auto focusing. And, we verified our equipment.
목차
ABSTRACT
1. 서론
2. 영상처리기반 측정 및 실시간 가공보정 시스템 개발
3. 결론
REFERENCES
참고문헌 (7)
참고문헌 신청
2. [학술지(정기간행물)] - A. Goshtasby / 1995 / Edge detection by curve fitting / Image and Vision Computing 13 : 169 ~ 177
3. [학술지(정기간행물)] - K. Kawahara / 1997 / Image processing with topology and mathematical morphology / IEICE Trans.D_II 1 : 166 ~ 174
4. [학술지(정기간행물)] - Petros Maragos / 1987 / Tutorial on advances in morphological image processing and analysis / Optical Engineering 26 (7) : 623 ~ 623
5. [학술지(정기간행물)] - Frei, W. / 1977 / Fast boundary detection : A Generalization and a New Algorithm / IEEE Trans Computers 26 (10) : 988 ~ 998
6. [학술지(정기간행물)] - M. Subbarao / 1993 / Focusing Techniques / Optical Engineering 32 (11) : 2824 ~ 2836
3. [학술지(정기간행물)] - K. Kawahara / 1997 / Image processing with topology and mathematical morphology / IEICE Trans.D_II 1 : 166 ~ 174
4. [학술지(정기간행물)] - Petros Maragos / 1987 / Tutorial on advances in morphological image processing and analysis / Optical Engineering 26 (7) : 623 ~ 623
5. [학술지(정기간행물)] - Frei, W. / 1977 / Fast boundary detection : A Generalization and a New Algorithm / IEEE Trans Computers 26 (10) : 988 ~ 998
6. [학술지(정기간행물)] - M. Subbarao / 1993 / Focusing Techniques / Optical Engineering 32 (11) : 2824 ~ 2836
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UCI(KEPA) : I410-ECN-0101-2014-580-002948416